3D NoC test TSV optimization based on improved quantuminspired evolutionary algorithm
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1.School of Electronic Engineering and Automation, Guilin University of Electronic Technology,Guilin 541004, China; 2.Guangxi Key Laboratory of Automatic Detection Technology and Instrument, Guilin 541004, China

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TH701

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    Abstract:

    Aiming atthe high production cost and the large occupied area of throughsiliconvias(TSVs)in threedimensional networkonchip,the test scheduling of 3D NoC is researched.To reduce the hardware overhead and improve the utilization rate in a limited number of TSVs, a new methodusing improved quantuminspired evolutionaryalgorithmis proposed, which is to configure TSVs in each layer according to the demandand allocate TSVs to each core reasonably and effectively. Moreover,the impact of TSVs’ allocation on testtime under the constraint of the shortest test time is discussed.To improve the ability of searching and converge speed, the strategy of dynamic adjustment of rotating angle of quantum rotating gate and quantum mutation are designed in the algorithm, which can prevent the algorithm from running into the local optimization solution effectively.Taking ITC’02 standard circuit as the test object, experiment is conducted,and the experiment results demonstrate that the proposed method can converge to the optimal solution quickly to reduce the total test time, and the number of TSVs can be optimized to improve the TSVs’ utilization.

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  • Received:
  • Revised:
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  • Online: September 16,2017
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