基于FPGA环形振荡电路的温度测量优化
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南京理工大学能源与动力工程学院南京210094

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TN431.2

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国家自然科学基金(52276070,92473204)项目资助


Optimization of temperature measurement based on FPGA ring oscillator circuit
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School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing 210094,China

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    摘要:

    环形振荡电路作为一种基于现场可编程门阵列(FPGA)的温度传感器,因其结构简单、成本低廉且易于集成的优势,在温度检测领域得到了广泛应用。然而,环形振荡电路的测温精度易受多种因素的影响,包括非门个数、非门布局、振荡频率、采样时长、采样间隔以及冷却时间等设计和操作参数。因此,如何优化这些参数以提升测温精度具有重要的研究意义。基于控制变量法,系统地分析了上述关键参数对环形振荡电路测温性能的影响。首先,通过实验研究不同非门个数对振荡频率与测温误差的影响,发现非门个数的增加会降低振荡频率;进一步实验表明,将非门个数优化设置为 40~48,可获得最佳的测温精度和分辨率。此外,对非门布局进行了深入分析,发现同可编程逻辑块(CLB)下左右Slice互连的延迟远大于跨 CLB 的互连延迟,通过布局优化选用特定的布局可以有效增加延迟,进而优化测温精度。通过对比采样时长、采样间隔及冷却时间等参数组合,提出了最优的系统参数配置。在最佳参数组合下的实验验证显示,温度误差最低可减少 0.5 ℃,在25 ℃~85 ℃环境下相较于对比参数组合,平均温度误差从2.0 ℃下降到了1.2 ℃,降低了0.7 ℃,且在 65 ℃以上的环境下,温度误差能够稳定控制在 ±1 ℃以内。最终结果证明,提出的参数优化方法显著提升了环形振荡电路的测温精度,为 FPGA 温度传感器的设计和应用提供了有力支持。

    Abstract:

    The ring oscillator (RO), as an FPGA-based temperature sensor, has been widely applied in the field of temperature detection due to its advantages of simple structure, low cost, and ease of integration. However, the temperature measurement accuracy of ring oscillators is susceptible to multiple factors, including the number of inverters, inverter layout, oscillation frequency, sampling duration, sampling interval, and cooling time, which are critical design and operational parameters. Therefore, optimizing these parameters to enhance measurement accuracy holds significant research importance. This paper systematically analyzes the impact of these key parameters on the temperature measurement performance of the ring oscillator using the control variable method. Firstly, experimental studies on the influence of different inverter counts on oscillation frequency and temperature error reveal that increasing the number of inverters decreases the oscillation frequency. Further experiments demonstrate that optimizing the inverter count to 40~48 achieves the best measurement accuracy and resolution. Additionally, this paper performs an in-depth analysis of the inverter layout, finding that the delay caused by interconnections between left and right slices within the same configurable logic block (CLB) is significantly greater than that of interconnections across CLBs. Through layout optimization and the selection of specific configurations, the delay can be effectively increased, thus improving measurement accuracy. By comparing various parameter combinations, such as sampling duration, sampling interval, and cooling time, the optimal system parameter configuration is proposed. The experimental validation under the optimal parameter combination shows that the temperature error can be reduced by at least 0.5 ℃.In the environment of 25 ℃~85 ℃, compared with the comparative parameter combination, the average temperature error has decreased from 2.0 ℃ to 1.2 ℃, which is a reduction of 0.7 ℃.Furthermore, at temperatures above 65℃, the temperature error remains consistently controlled within ±1℃.The final results demonstrate that the parameter optimization method proposed in this paper significantly enhances the temperature measurement accuracy of the ring oscillator, providing strong support for the design and application of FPGA-based temperature sensors.

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朱忠峻,胡定华,李强,周凯航.基于FPGA环形振荡电路的温度测量优化[J].电子测量与仪器学报,2025,39(3):102-114

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  • 在线发布日期: 2025-05-16
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