高频板材的复介电常数测量方法研究
DOI:
CSTR:
作者:
作者单位:

作者简介:

通讯作者:

中图分类号:

TN806; TM934. 32

基金项目:

国家重点研发计划(2022YFE0122700)项目资助


Research on the measurement of complex permittivity of high-frequency substrate
Author:
Affiliation:

Fund Project:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
  • |
  • 文章评论
    摘要:

    复介电常数是高频板材最重要的参数之一,准确测量高频板材的介电常数和损耗,对板材的实际应用十分重要。 为了 获得板材的损耗特性,设计了一种基于微带线的传输线电路,并对长度分别为 25. 4 和 127 mm 的微带传输线进行仿真、加工和 测试,得到 DC-20GHz 内的回波损耗 S11 和插入损耗 S21 ,测试数据表明,S11 值测试结果在-15 dB 以下,且在 20 GHz 下传输线的 插入损耗为 24. 02 dB/ m。 通过加工误差分析,电路参数变化 50 μm 时,DC-20GHz 内仿真 S11max 变化可达到 6 dB 左右。 最后结 合谐振环法对同一种板材进行测试,得到板材的相对介电常数和损耗角正切。 结果表明该方法得到的损耗角正切精确度较高, 且在 2、10 和 20 GHz 频段下误差小于 10%。

    Abstract:

    Complex permittivity is a crucial parameter for high-frequency substrate. Precise measurement of dielectric constant and loss is essential for the practical application of high-frequency substrate. A transmission line circuit based on microstrip lines was designed to obtain the loss characteristics of the substrate. Microstrip transmission lines of 25. 4 and 127 mm in length were simulated, fabricated, and measured to obtain the return loss S11 and insertion loss S21 within DC-20GHz. The measured data indicates that the results of S11 are below -15 dB, and the insertion loss of the transmission line is 24. 02 dB/ m at 20 GHz. By processing error analysis, the change of simulated S11max within DC-20GHz can reach about 6 dB when circuit parameters changed by 50 μm. Finally, the relative dielectric constant and loss tangent of the substrate are obtained by combining the resonant ring method with the same substrate. The results demonstrate that this method yields a high degree of accuracy for the loss tangent, with an error of less than 10% at 2, 10 and 20 GHz.

    参考文献
    相似文献
    引证文献
引用本文

陈佳慧,杜宏宇,任英杰,周 蓓,杨 蓉,刘 傲,万发雨.高频板材的复介电常数测量方法研究[J].电子测量与仪器学报,2023,37(6):178-186

复制
分享
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
  • 引用次数:
历史
  • 收稿日期:
  • 最后修改日期:
  • 录用日期:
  • 在线发布日期: 2023-09-22
  • 出版日期:
文章二维码