| 常家齐,朱敏杰,杜晓辉,刘帅,朱可涵,陈凡红.X射线平板探测器可靠性强化试验及故障分析[J].电子测量与仪器学报,2025,39(12):10-18 |
| X射线平板探测器可靠性强化试验及故障分析 |
| X-ray flat panel detector reliability enhancement test and failure analysis |
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| DOI： |
| 中文关键词: X射线平板探测器 可靠性强化试验 故障分析 缺陷检测 |
| 英文关键词:X-ray flat panel detector reliability enhancement testing failure analysis defect detection |
| 基金项目: |
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| Author | Institution |
| Chang Jiaqi | Instrumentation Technology & Economy Institute, Beijing 100055, China |
| Zhu Minjie | Instrumentation Technology & Economy Institute, Beijing 100055, China |
| Du Xiaohui | Instrumentation Technology & Economy Institute, Beijing 100055, China |
| Liu Shuai | Instrumentation Technology & Economy Institute, Beijing 100055, China |
| Zhu Kehan | Instrumentation Technology & Economy Institute, Beijing 100055, China |
| Chen Fanhong | Instrumentation Technology & Economy Institute, Beijing 100055, China |
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| 中文摘要: |
| 面向X射线平板探测器研发阶段的可靠性优化，提出了一种多维度可靠性强化试验方法。选取两款平板探测器为试验对象，结合其实际服役环境，设计并实施了低温步进、高温步进、快速温变、振动步进、恒定湿热步进、恒定湿热极限、交变湿热及综合环境8种应力加载试验，并搭建了暗场灰度值测量系统以检测性能变化。结果表明，两款探测器在全温区均能保持稳定运行，在振动步进试验中，探测器1在10 grms时出现短暂断连但可恢复，探测器2在8 grms时发生不可逆故障。在湿度95%RH条件下，两款探测器均能正常工作，但在综合环境试验中，探测器1失效且无法恢复，说明多因素耦合环境对损伤具有显著加速作用。显微镜与X射线透射表征揭示了焊点开裂、印制电路板（PCB）裂纹、导线错位和表面污染是主要失效模式，机械应力与湿热环境的协同作用显著加快了材料老化与界面退化。基于此，提出了从焊接工艺优化、洁净度控制、印刷电路板抗振设计及芯片导线固定工艺等方面的改进建议，为X射线平板探测器的设计与制造可靠性提升提供了思路和参考依据。 |
| 英文摘要: |
| For reliability optimization during the development of X-ray flat panel detectors, this study proposes a multi-dimensional reliability enhancement testing method. Two flat panel detectors were selected as test subjects. Considering their actual service environments, eight stress-loading tests were designed and conducted, including low-temperature stepping, high-temperature stepping, rapid temperature variation, vibration stepping, constant humidity heat stepping, constant humidity heat limit, alternating humidity heat, and comprehensive environmental tests. A dark-field grayscale measurement system was established to monitor performance variations. The results show that both detectors maintained stable operation across the full temperature range. In the vibration stepping test, detector-1 exhibited a temporary disconnection at 10 grms but was recoverable, whereas detector-2 experienced irreversible failure at 8 grms. Under 95%RH conditions, both detectors functioned normally. However, detector-1 failed and could not recover under the comprehensive environmental test, indicating that multi-factor coupled environments significantly accelerate damage. Microscopy and X-ray transmission characterization revealed that solder joint cracking, PCB fractures, wire misalignment, and surface contamination were the primary failure modes, and that the synergistic effects of mechanical stress and humidity markedly accelerated material aging and interfacial degradation. Based on these findings, we propose improvements in soldering-process optimization, cleanliness control, printed-circuit-board anti-vibration design, and chip-wire fixation, thereby providing insights and references for enhancing the reliability of X-ray flat panel detector design and manufacturing. |
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