A binocular vision based probe package pad rapid alignment technique is proposed to address the challenge of rapid positioning between probes and chip packaging pad in electrostatic discharge (ESD) testing of charged device models (CDM). Firstly, a set of image datasets for chip packaging is constructed, and a lightweight L-YOLOv8n algorithm is used to train the model as the front-end recognition of the chip under test. Then, the sub-pixel segmentation and positioning of the pad are completed through the image processing module, and the three-dimensional coordinate information of the pad is accurately obtained based on visual difference and stereo matching. Finally, the information is sent to the main control board of the CDM ESD testing system to control the stepper motor and achieve fast and accurate alignment between the probe and pad. The experimental results show that the system has an mean average precision (mAP) of over 99% for various packaged chips such as BGA and SOP under small sample training conditions, and achieves complete recognition of pad and accurate extraction of three-dimensional coordinates. The positioning accuracy in the horizontal two-dimensional direction reaches 0.01 mm, and the depth direction accuracy is 0.1 mm. At the same time, the system has significant advantages in low cost and strong environmental adaptability, without the need for manual alignment of probes with pad for testing. The rapid and accurate alignment of probe pad can be completed with only camera equipment and motion control modules, which is easy to deploy and suitable for CDM testing in multiple scenarios and various chip packaging types.