| 关存贺,许高斌,王焕章,张 宇,马渊明.复杂应力条件下 MEMS 加速度传感器可靠性分析[J].电子测量与仪器学报,2023,37(7):17-25 |
| 复杂应力条件下 MEMS 加速度传感器可靠性分析 |
| Reliability analysis of MEMS acceleration sensors under complex stress conditions |
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| DOI： |
| 中文关键词: MEMS 加速度传感器 多环境应力 可靠性 全概率公式 |
| 英文关键词:MEMS accelerometer multi-environmental stress reliability full probability formulation |
| 基金项目:国家重点研发计划(2020YFB2008901)、安徽省发改委研发创新(JZ2021AFKJ0050)项目资助 |
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| Author | Institution |
| Guan Cunhe | 1. School of Microelectronics, Hefei University of Technology,2. Micro Electromechanical System Research Center of Engineering and Technology of Anhui Province |
| Xu Gaobin | 1. School of Microelectronics, Hefei University of Technology,2. Micro Electromechanical System Research Center of Engineering and Technology of Anhui Province |
| Wang Huanzhang | 1. School of Microelectronics, Hefei University of Technology,2. Micro Electromechanical System Research Center of Engineering and Technology of Anhui Province |
| Zhang Yu | 1. School of Microelectronics, Hefei University of Technology,2. Micro Electromechanical System Research Center of Engineering and Technology of Anhui Province |
| Ma Yuanming | 1. School of Microelectronics, Hefei University of Technology,2. Micro Electromechanical System Research Center of Engineering and Technology of Anhui Province |
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| 中文摘要: |
| 针对 MEMS 加速度传感器在复杂应力条件下潜在的疲劳失效与断裂失效问题,提出了一种基于全概率公式的可靠性
评估模型,完成了器件在振动环境、冲击环境以及振动-冲击耦合环境下的可靠性建模。 模型包含 Wiener 过程和齐次泊松随机
过程,分别描述器件在振动环境中的疲劳损伤以及器件遭受的随机冲击,进一步考虑了随机冲击的幅值大小对器件退化率的影
响。 通过器件在冲击应力下产生的疲劳损伤突增量,反映多失效模式间的相关性。 对比分析了振动-冲击相互独立与相互耦合
作用的可靠性模型,结果表明,振动-冲击相互耦合作用的可靠性模型评估结果更具有指导意义。 |
| 英文摘要: |
| A reliability assessment model based on the total probability formula is proposed to address the potential fatigue failure and
fracture failure of MEMS acceleration sensors under complex stress conditions. The model accomplishes reliability modeling of the device
in vibration, impact, and vibration-impact coupled environments. The model includes the Wiener processes and the homogeneous
poisson random processes, which describe the fatigue damage of the device in the vibration environment and the random impact of the
device, respectively. Furthermore, the influence of the amplitude of random impacts on the device degradation rate is considered. The
correlation between multiple failure modes is reflected by the sudden increase in fatigue damage generated by the device under impact
stress. A comparative analysis was conducted to compare the reliability models considering the independent and coupled effects of
vibration and impact. The results demonstrate that the reliability model considering the coupled effects of vibration and impact provides
more meaningful guidance in the evaluation. |
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