陈少轩,陈 诚,张宏儒.复合柔性电子变形失配数字图像相关研究[J].电子测量与仪器学报,2020,34(6):48-53
复合柔性电子变形失配数字图像相关研究
Digital image correlation research on deformation mismatch of composite flexible electronics
  
DOI:
中文关键词:  数字图像相关  复合柔性电子  Von Mises 应变  变形失配  
英文关键词:digital image correlation  composite flexible electronics  Von Mises strain  deformation mismatch
基金项目:天津市自然科学基金(17JCZDJC38200)资助
作者单位
陈少轩 1.天津商业大学机械工程学院 
陈 诚 1.天津商业大学机械工程学院 
张宏儒 1.天津商业大学机械工程学院 
AuthorInstitution
Chen Shaoxuan 1.School of Mechanical Engineering, Tianjin University of Commerce 
Chen Cheng 1.School of Mechanical Engineering, Tianjin University of Commerce 
Zhang Hongru 1.School of Mechanical Engineering, Tianjin University of Commerce 
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中文摘要:
      为了定量表征复合柔性电子相邻层变形失配程度,设计了一种基于数字图像相关(digital image correlation, DIC)的实验 系统和变形失配评价方法。 首先制备复合柔性电子样品,通过平移实验对实验系统进行验证,其次在不同温度下对样品进行单 轴拉伸,计算 Von Mises 应变,最后通过定义图案化应变波动指数 P 来对变形失配程度进行表征。 实验结果表明,实验系统平 移误差在 1%之内,满足变形测量要求。 50 ℃下样品被拉伸 2 mm,Von Mises 应变最大值与最小值相差约 65%,样品呈现出应 变大小不均匀但应变分布均匀的变形失配。 同一拉伸条件下,变形失配程度在 25℃ ~ 75℃变化较小,100℃下变化明显,增加了 近 60%,该方法有效的表征了柔性电子变形失配程度。
英文摘要:
      In order to quantitatively characterize the degree of deformation mismatch of adjacent layers of composite flexible electronics, an experimental system based on digital image correlation (DIC) and a method of evaluating deformation mismatch are designed. First, a composite flexible electronic sample was prepared, and the experimental system was verified through translation experiments. Second, the sample was uniaxially stretched at different temperatures and the Von Mises strain was calculated. Finally, the degree of deformation mismatch was Characterized by defining the patterned strain fluctuation index P. The experimental results showed that the translation error of the experimental system was within 1%, which meets the requirements of deformation measurement. The sample was stretched by 2 mm at 50 ℃ , and the maximum and minimum strains of Von Mises differed by about 65%. The sample showed deformation mismatch with uneven strain value but uniform strain distribution. Under the same tensile conditions, the degree of deformation mismatch changed little from 25 ℃ to 75 ℃ , and it changed significantly at 100℃ , the increment was about 60%. This method effectively characterizes the degree of flexible electronic deformation mismatch.
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